Backing plates are available in the following materials –
- Stainless Steel
Backing plates are available for the following systems –
- Perkin Elmer
- And Custom Designed Systems!
Backing Plate Material –
- Oxygen-Free Copper: The most common backing plate material is Oxygen Free (OFHC) Copper. This metal has good electrical and thermal characteristics while also being easy to machine, easy to soften, and readily available at a low cost. Copper backing plates can be re-used, with care, 20 or more times.
- Molybdenum: For applications where Copper is not appropriate, we often substitute Molybdenum. For some materials, such as ceramics, or even metals made via Powder Metallurgy, the coefficient of expansion for Copper is mismatched. For applications where a high temperature bond is required, Copper may also oxidize badly or warp.
- Copper and Stainless Steel Cups: We specialize in the use of unique backing plate geometry for delicate ceramic targets ranging in size 0.5” to 8”. The ‘cup’ design provides good mechanical support for the target on the back and around the edge. This improves both heat transfer to the cooling well of the cathode and increased mechanical integrity by providing a clamping point for the assembly which does not stress the target.